LM3102 DATASHEET PDF

TI is not responsible or liable for any such statements. The bootstrap capacitor C4 should be connected as close to the SW and BST pins as possible, and the connecting traces should be thick. How much energy is. The output capacitor C10, C11 should be connected close to the load and tied directly to the ground plane. To ensure that the on-time is larger than the minimum limit, which is ns, the value of R1 must satisfy the following equation: The input capacitor is calculated from: Determine the inductance The main parameter affected by the inductor is the amplitude of the inductor current ripple ILR. If the output voltage is higher than 1.

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TI is not responsible or liable for any such statements. The bootstrap capacitor C4 should be connected as close to the SW and BST pins as possible, and the connecting traces should be thick.

How much energy is. The output capacitor C10, C11 should be connected close to the load and tied directly to the ground plane.

To ensure that the on-time is larger than the minimum limit, which is ns, the value of R1 must satisfy the following equation: The input capacitor is calculated from: Determine the inductance The main parameter affected by the inductor is the amplitude of the inductor current ripple ILR. If the output voltage is higher than 1. Using numerous vias to connect the die attached pad to the ground plane is a good practice. The function of the input capacitor is to supply most of the main MOSFET current during the on-time, and limit the voltage ripple at the VIN pin, assuming that the voltage source feeding to the VIN pin has finite output impedance.

LMQ1 from Texas Instruments Experimentation is usually necessary to determine the minimum value for the output capacitor, as the nature of the load may require a larger value. Protection features include output over-voltage protection, thermal shutdown, VCC undervoltage lock-out, gate drive under-voltage lock-out.

Layout is therefore critical for optimum performance. In this demonstration board, a 10 nF capacitor is used. Products Applications Audio www. Calculate the on-time setting resistor The switching frequency fSW of the demonstration board is affected by the on-time ton of the LM, which is determined by R1.

For a worst case calculation, the input capacitor must be capable of supplying this average load current during the maximum on-time. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.

No TI components are authorized for use in FDA Class III or similar life-critical medical equipment unless authorized officers of the parties have executed a special agreement specifically governing such use. The average current during the on-time is the load current. Judicious positioning of the PC board within the end product, along with the use of any available air flow forced or natural convection can help reduce the junction temperature.

Headline Bold Ipsum lorem Headline Light. The operating frequency remains constant with line variations due to the inverse relationship between the input voltage and the on-time. The capacitor at the SS pin determines the soft-start time, that is, the time for the reference voltage at the regulation comparator and the output voltage to reach their final value.

Documents Flashcards Grammar checker. LM3 Molded Inductor Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.

The connection datasheer the PGND pin to the input capacitors should be as short and direct as possible. A nF capacitor is used in this demonstration board. A low ESR 0. Buyer acknowledges and agrees that it is solely responsible datashet compliance with all legal, regulatory and safety-related requirements concerning its products, and any use darasheet TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI.

Datqsheet the feedback resistors The ratio of the feedback resistors can be calculated from the dayasheet equation: The demonstration board schematic, PCB layout, Bill of Materials, and circuit design datsheet are shown. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used.

Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Nonetheless, such components are subject to these terms. Low ESR also helps ensure a complete recharge during each off-time.

I wish to measure a very low resistance of the order of an ohm. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. The exposed pad on the bottom of the LM IC package can be soldered to the ground plane, which should extend datasheett from beneath the LM to help dissipate heat.

It then drops to zero at turn-off. Buyers are responsible for their products and applications using TI components. The exposed pad is internally connected to the LM IC substrate. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration dataheet is accompanied by all associated warranties, datashdet, limitations, and notices.

Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof.

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Vudorn Buyers are responsible for their products and applications using TI components. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Judicious positioning of the PC board within the end product, along with the use of any available air flow forced or natural convection can help reduce the junction temperature. Reproduction of significant portions of Km information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Determine the value of other components C1 and C2: Protection features include output over-voltage protection, thermal shutdown, VCC undervoltage lock-out, gate drive under-voltage lock-out.

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